Advancing Semiconductor Design: Our Presence at SemIsrael Expo 2025

Our Participation at SemIsrael Expo 2025

SignOff Semiconductors will proudly participate in the SemIsrael Expo chip design track on Tuesday, 11 November, 2025 at the Avenue Convention Centre Airport City Israel. This prestigious event is a much-awaited gathering for the global semiconductor industry, connecting technologists and innovators who are shaping next-generation silicon architectures.

We will interact with leading fabless teams, engineering leaders, and system innovators at the Expo. Our aim is to support high-growth technology programs with precise execution and quality engineering.

Strategic Vision and Networking Opportunities

Israel remains a powerhouse in AI computing, connectivity, radar, medical technology, and automotive intelligence. With strong research universities and venture-backed semiconductor innovation, the region thrives on rapid architecture cycles.

We look forward to meaningful conversations and networking opportunities at the Semiconductor Israel Expo to explore collaboration for first-pass silicon success and rapid product validation.

Engineering Depth and Post-Silicon Validation Leadership

We build our technical foundation on high-rigor silicon execution, from SPEC to GDSII, and provide post-tape out enablement. With proven capabilities across physical design, STA clocking methodology, IR, EM closure, DFT, MBIST, ATPG, and sign-off flows, we support complex technology programmes with confidence and scale. We have delivered 20 plus  tape-outs an advanced tech nodes (7nm–3nm).

Technical Expertise Aligned to Chip Design Trends 2025 Israel

Our project portfolio includes automotive ADAS compute edge-AI controllers’ radar and secure industrial silicon. We’ve supported multiple production tapeouts on advanced nodes (TSMC N7/N5/N3) with proven success in timing closure, DFT signoff.

We act as a seamless extension to your design team, by bringing scale, predictable quality, and round-the-clock execution across RTL-to-GDSII. Our engagements operate under strict IP isolation, with traceable access controls and dedicated teams per project.

These capabilities position us to contribute meaningfully to evolving chip design trends in 2025 in Israel, particularly in AI acceleration, sensor fusion, safety architectures, and embedded security.

Collaborative Execution for Seminar on Semiconductor Design in Israel

Israel excels in system architecture, IP development, and algorithm acceleration. SignOff strengthens programmes by addressing bandwidth bottlenecks and enabling local engineering teams to stay focused on core innovation.

Our operational model supports round-the-clock execution, delivering predictable quality, schedule adherence, as well as accelerated tape-outs for teams driving discussions at leading seminars on semiconductor design in Israel.

Execution Value for Fast-Growth Fabless Teams

By partnering with us, startups and established design groups gain architectural freedom while our engineering teams manage physical design verification, DFT post-silicon workflows, and platform enablement.

This partnership framework continues to find relevance with our fabless customers in Silicon Valley, which require precision, technical maturity and execution acceleration.

Delivering Global Semiconductor Excellence

Semiconductor systems are becoming more intelligent, power-efficient, and security-driven. Our participation at SemIsrael Expo 2025 showcases our commitment to global silicon innovation. 

We look forward to leveraging the networking opportunity at the Semiconductor Israel Expo and Chip Design Trends 2025. Our objective is to help Israeli innovators create safe, reliable, energy-efficient, and scalable semiconductor platforms that will influence future technology.

Meet our leadership and engineering delegation at SemIsrael Expo and take the first step toward growing your silicon presence. Engage with us to unlock turnkey execution, rapid co-development support, and proven pathways to first-pass silicon success. If you are ready to move faster and scale smarter, this is your moment to connect.

Secure your meeting now by contacting Mr Gary Golembo, who is heading our delegation at the Expo, at email ID gary@mosaic-ic.com or reach us at sales@signoffsemi.com. Lock in your discussion slot, align with execution experts and move your architecture to silicon with confidence, speed and zero compromise on quality.