Circuit and Layout Design
End-to-end silicon, system and hardware services all under one roof!
Signoff Engineering Team has extensive experience in circuit and layout designing. We provide support in various designs from transistor level, block level, IP level, chip level. Signoff Team has experience on different process nodes to the cutting edge technology: Planar (180nm, 130nm, 110nm, 65nm, 55nm, 45nm, 40nm, 32nm, 28nm, 20nm and more) and Finfet (16nm/14nm, 12nm, 10nm, 7nm, 6nm, 5nm) with foundry TSMC, Samsung, UMC, GF and Intel.
Our expertise, methodology and commitment in following areas ensures quality deliverables with full support to have customer product successful.
Standard Cell
- High Density, High Speed, Low power
- Design, Layout and Characterization
Analog & Mixed Signal
- ADC, DAC, Regulator, PLL, DLL, Transmitter (TX), Receiver (RX)
- High-Speed Serdes, DDR, other PHY Interfaces, USB, Die-to-Die etc
Memory
IO PAD Library
Design & Simulation
AMS Verification
Block level, IP level and Chip level Layout
Post Layout Extraction (PEX) Simulation & Verification
Physical Verifications (ANT, DRC, DFM, LVS, ERC, PAD, PERC, ESD/Latch-up, EMIR/SHE etc)
Our Services
We create a smarter device-driven world
Our high-performance teams can leverage this valuable experience to help deliver innovative solutions. This enables our clients to deliver on aggressive schedules and stay competitive in their respective markets with high efficiency.
Digital Backend Design
Digital Frontend Design
Circuit and Layout Design
Embedded
Services
Internet of Things
(IoT)
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